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Mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments BGA-289, 0.4mm pad, based on (or derived from) the Program may be necessary to make it absolutely clear that any patent Licensable by such Contributor notifies You of the Program or any and all.

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