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Row_6, 0]; audio_in_1 = [left_col, row_3, 0]; manual_2 = [left_col, row_2, 0]; triangle_out = [third_col, fourth_row, 0]; //Fifth row interface placement sync_in = [first_col, fourth_row, 0]; pwm_in = [width_mm - h_margin - working_width/8, row_3, 0]; manual_2 = [left_col, row_1, 0]; fm_pot = [input_column + h_margin/2, bottom_row, 0]; c_tune = [width_mm/2 + h_margin, top_row, 0]; f_tune = [second_col, second_row, 0]; //Third row interface placement pwm_in = [input_column - h_margin/2, row_1, 0]; pwm_in = [input_column + h_margin/2, bottom_row, 0]; pwm_pot = [input_column - h_margin/2, row_1, 0]; square_out = [output_column, bottom_row, 0]; cv_in = [first_col, fifth_row, 0]; //left_rib_x = thickness * 2; right_rib_x = width_mm - hole_dist_side, height - hole_dist_top); } module rail(height) { difference() { union() { difference(){ railRect(height); railSlot(height); railSupportCavity(height); } } Notes: - Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack 2mm 2.5mm KLDX-0202-BC KLDX-0202-AC 1.10mm Pitch microSD Card Connector, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0140, 14 Circuits (https://www.molex.com/pdm_docs/sd/2005280140_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 14-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments BGA-289, 0.4mm pad, based on https://www.analog.com/media/en/technical-documentation/data-sheets/199399fc.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (2mm x 2mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, though-hole, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Piano 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row.

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