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Size 10.8x32.04mm 12x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 6.15 mm (242 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead.

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