3
1
Back

Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CB), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0710, with PCB locator, 10.

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