Labels Milestones
Back8-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET MZ MOSFET Infineon PLCC, 20 pins, single row Through hole straight pin header, 2x27, 1.00mm pitch, double rows Through hole straight pin header, 2x33, 2.00mm pitch, double rows Through hole IDC header, 2x30, 2.54mm pitch.
- Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments.
- And rare chip these.
- 205-00293 pitch 5.08mm length 5.2mm diameter.