Labels Milestones
BackMm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP DIL ZIF 7.62mm 300mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin.
- 2.751995e+000 3.098315e+000 2.484855e+001 facet.
- Compiled binary, for any.
- 2.54mm, package size 11.6x8.5x10.4mm^3.