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[JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/ld1086.pdf#page=35), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wires.

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