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13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ loose fit solder Pin_ diameter 1.0mm, hole diameter 1.3mm, hole diameter 1.3mm, wire diameter 1.0mm THT rectangular pad as test point, pitch 6.35mm, hole diameter 1.0mm THT pad as test Point, square 4.0mm side length.

• BGA, 16x16 grid, 17x17mm package.
• SM05B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Stocko MKS.
• Strip, HLE-103-02-xxx-DV-BE-LC, 3 Pins per row.

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