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Files *.000 *.bak *.bck *.zip *.DS_Store *~ .gitignore-extra *.dsn *.kicad_pcb-bak *.kicad_sch-bak *.kicad_prl *.kicad_pro *.rules *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache # Netlist files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: ============================================================= 14162964f93e8c9aadec1d2edfbf49ea0b8bcb52 Add Kick as separate sheet wants to merge 3 commits from pcb_finalization into main Merge pull request 'new_footprints' (#5) from new_footprints into main 1705ad98fb Put title box in PDF export' (#4) from schematic into main Merge pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 Component Count: 76 Refs C2, C5, C6, C8, C9 D1, D2, D3, D4, D5, D6, D7, D8, D9, D10 | 8 | 1N4148 | 100V 0.15A standard switching diode, DO-35 | | | | | | | | | L1 | 1 | 10nF | Ceramic capacitor | | | | | | Tayda | A-553.

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