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KingTek_DSHP03TS, Slide, row spacing 6.73 mm (264 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0020, 20 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin, RGY0020A (https://www.ti.com/lit/ds/symlink/txb0108.pdf#page=33 Texas RSE0010A UQFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900FM15K0039/0900FM15K0039.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-pin SOT-23 package, Handsoldering, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sot-23rj/rj_8.pdf SOT-143R, reverse pinning, https://www.nxp.com/docs/en/package-information/SOT143R.pdf SOT-143R, reverse pinning, https://www.nxp.com/docs/en/package-information/SOT143R.pdf SOT-143R, reverse pinning, https://www.nxp.com/docs/en/package-information/SOT143R.pdf SOT-143R, reverse pinning, Handsoldering, https://www.nxp.com/docs/en/package-information/SOT143R.pdf module CMS SOT223 5 pins, pitch 3.5mm, size 36x8.3mm^2, drill diamater 1.15mm, pad diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/10690.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block 4Ucon ItemNo. 10694, vertical (cable from top), 9 pins, pitch 10mm, size 55x10.3mm^2, drill diamater 1.15mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0018 example for new part number: 22-27-2091, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B8PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-121-02-xxx-DV-BE-LC, 21 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.

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