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BackSMD 8.4x7.2mm Ethernet Transformer, Bel S558-5999-T7-F, https://www.belfuse.com/resources/ICMs/lan-/S558-5999-T7-F.pdf Transformer Ethernet SMD, https://www.haloelectronics.com/pdf/discrete-genesus.pdf Halo N2 SO, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Piano, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package.
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