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Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf dc-dc recom buck sip-12 pitch 2.54mm size 10.620000000000001x6.5mm^2 drill 1.1mm pad 2.2mm Terminal Block 4Ucon ItemNo.

• \npolyester film looks much \nbetter." (tool.
• Layout Update luther's layout Update.

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