synth_tools

Back

Phoenix MKDS-1,5-14 pitch 5mm size 55x9mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-1,5-6-5.08 pitch 5.08mm 1.5W length 14.3mm diameter 5.7mm Resistor, Axial_DIN0614 series, Axial, Vertical, pin pitch=7.62mm, , length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf Inductor Axial series Axial Horizontal pin pitch 8.40mm length 21.6mm width 9.1mm Bourns 5700 L_Toroid, Vertical series, Radial, pin pitch=10.00mm, diameter=26mm, height=45mm, Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf CP Axial series Axial Horizontal pin pitch 11.43mm length 28.6mm width 14.3mm Bourns 5700 L_Toroid, Vertical series, Radial, pin pitch=5.00mm, , length*width=7*3.5mm^2, Capacitor C Radial series Radial pin pitch 33mm length 26.5mm width 7mm Capacitor C, Rect series, Radial, pin pitch=15.00mm, , length*width=18*6mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf C Rect series Radial pin pitch 7.50mm length 10mm width 3.0mm solder Pin_ with flat fork, hole diameter 0.5mm test point THT pad as test Point, square 2.5mm side length, hole diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.15 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0230, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C)), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/si512-13.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.5mm, hole diameter 1.3mm, wire diameter 0.5mm test point SMD pad as test point, loop diameter2.6mm, hole diameter 0.5mm test point THT pad rectangle square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 3 pin, 2.0mm.

New Pull Request

Labels Milestones