Labels Milestones
BackBGA Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x04 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x03 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted socket strip SMD 2x11 1.00mm double row surface-mounted straight pin header, 1x21, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip SMD 1x30 2.00mm single row style2 pin1 right Through hole straight pin header, 2x02, 1.27mm pitch.
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