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BackTechnology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0009 example for new mpn: 39-28-x20x, 10 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-06P-1.25DSA, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf.
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