synth_tools

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Package; 28 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP.

Module, Patch on Top, https://www.quectel.com/UploadImage/Downlad/Quectel_L80-R_Hardware_Design_V1.2.pdf.
8.0x6.3x5.3mm (https://productfinder.pulseeng.com/products/datasheets/SPM2007_61.pdf SMT Gate Drive Transformer, 1:1:1, 11.8x8.8x4.0mm.
| Conn_01x07 | \*(optional) SIP socket, 2.54.

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