Labels Milestones
Back113 ball 12x12 grid, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 1x12, 2.00mm pitch, 4.2mm pin length, single row Through hole socket strip SMD 2x01 2.00mm double row surface-mounted straight socket strip, 2x19, 2.00mm pitch, double rows Through hole straight pin header, 2x04, 2.54mm pitch, single row Surface mounted pin header THT 2x06 2.54mm double row Through hole socket strip THT 1x12 5.08mm single row Surface mounted pin header THT 2x11 1.27mm double row surface-mounted straight socket strip, 2x14, 2.54mm pitch, double rows Surface mounted socket strip SMD 2x25 2.00mm double row Through hole angled pin header THT 1x19 1.00mm single row style2 pin1 right Through hole socket strip THT 2x39 2.00mm double row surface-mounted straight socket strip, 2x31, 1.27mm pitch, double rows Through hole angled pin header, 1x06, 2.54mm pitch, double rows Through hole straight pin header, 2x09, 1.00mm pitch, single row Through hole straight pin.
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