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Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm.

• Electronics 9774030943 (https://katalog.we-online.de/em/datasheet/9774030943.pdf), generated.
• -0.528256 -0.643709 0.553701 vertex.
• 6.51059 -0.364032 7.33259 vertex 6.45682.

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