Labels Milestones
Back& tracing; schematic annotation updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZR pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 15x15 grid.
- Hardware/PCB/precadsr_Gerbers/precadsr-job.gbrjob create mode 100644 3D.
- -0.979674 -0.18785 -0.0703618 vertex 7.46167.
- 0.135125 -0.297024 0.945261 facet normal.
- -5.923284e-14 facet normal -0.360203 0.282966.
- 0.367742 -0.111553 0.923213 vertex 2.64292.