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Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 456, 1.94x2.4mm.

• -3.4335 8.28921 4.79464 facet normal 0.225392 0.184975.
• 0.870372 0.0994135 vertex 3.40623 -7.23862.

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