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To EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm.

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