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4.891x5.692mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole angled socket strip THT 2x23 2.54mm double row Through hole angled pin header THT 2x16 2.54mm double row Through hole angled pin header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x21, 2.54mm pitch, single row Through hole straight pin header, 1x29, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x10 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x10 2.54mm single row Through hole pin header THT 2x15 2.00mm double row Through hole socket strip THT 2x35 1.27mm double row Through hole angled pin header, 1x32, 1.00mm pitch, 2.0mm height, https://www.molex.com/pdm_docs/sd/541325033_sd.pdf Molex FFC/FPC connector, FH12-17S-0.5SH, 17 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator.

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