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CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module with on-board antenna Class 2 Bluetooth Module with on-board antenna Class 2 Bluetooth Module with on-board Fireball/Fireball.kicad_pcb | 8194 Fireball/Fireball_panel.kicad_pro | 504 Fireball/fp-info-cache | 51 ...D_DO-41_SOD81_P7.62mm_Horizontal.kicad_mod | 51 ...D_DO-41_SOD81_P7.62mm_Horizontal.kicad_mod | 51 create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/SPDT-toggle-switch-1M-series.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-16_W7.62mm_Socket_LongPads.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-6_W7.62mm_Socket_LongPads.kicad_mod delete mode 100644 .gitmodules delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Bourns_3296W_Vertical_screw_centered.kicad_mod delete mode 100644 3D Printing/Rails/36hp_innie.stl Normal file Unescape Schematics/Unseen Servant/Unseen Servant Front Panel v1.kicad_pcb Normal file View File Panels/Font files/futura medium condensed bt.ttf and /dev/null differ From 900028d3cfd83c8e79e6eea5e382790306fbb1e8 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Upload files to '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/HOLD PORTAL.png differ Binary files /dev/null and b/Docs/precadsr.pdf differ main synth_tools/Schematics/SynthMages.pretty/PinSocket_1x02_P2.54mm_Vertical.kicad_mod 42 lines synth_tools/PCB Notes.txt 17 lines Notes from MK's PCB livestream - avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals PCB layout: make power connection traces larger; MK uses a ground plane created pull request synth_mages/MK_SEQ#2 Added schmancy pcb for v1 front panel 24ca7abc85681936397a2802c8155420fcaf679c Added schmancy pcb for v2 front panel 24ca7abc85681936397a2802c8155420fcaf679c updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4x4mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25.

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