Labels Milestones
BackDIL, 4.5x4mm, area: 2.2x2.2mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5989350/BP%20104%20FAS_EN.pdf PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for diode bridges, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R5xxxDA, SIP-12, Horizontally Mounted, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78Bxx-2.0.pdf dc-dc recom buck sip-4 pitch 2.54mm length 5.3mm diameter 2.2mm Vishay IM-1 Inductor, Axial series, Axial, Horizontal, pin pitch=12.7mm, , length*diameter=7.6*3.6mm^2, , http://www.diodes.com/_files/packages/DO-15.pdf Diode DO-15 series Axial Horizontal pin pitch 7.62mm length 5.2mm diameter 2.7mm Vishay IM-2 Inductor, Axial series, Axial, Horizontal, pin pitch=15.3mm, 3W, length*width=16.3*4.8mm^2, https://www.bourns.com/pdfs/PWR4412-2S.pdf Resistor Bare_Metal_Element series Bare Metal Strip/Wire, Horizontal, pin pitch=20.32mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf Resistor Axial_DIN0207 series Axial Horizontal pin pitch 15.00mm diameter 21mm Vishay IHB-2 Inductor, Radial series, Radial, pin pitch=5.00mm.
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