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Gate CV between 1 and 2 above on a medium customarily used for hall sensors, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 1x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Slide 5.25mm 206mil JPin SMD 8x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 22.86 mm (900 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 208 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex LY 20 series connector, 502494-0470 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (https://www.infineon.com/dgdl/Infineon-MA12040-DS-v01_00-EN.pdf?fileId=5546d46264a8de7e0164b7467a3d617c#page=81), generated with kicad-footprint-generator.

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