Labels Milestones
BackOpener Relay SPST Schrack-RP3SL RM5mm 16A 250V AC Form C http://image.schrack.com/datenblaetter/h_rt114012--_de.pdf Relay SPST Schrack-RP3SL RM5mm 16A 250V AC Relay Relay SPST Schrack-RT2 RM5mm 16A 250V AC Relay Relay SPST Schrack-RT1 RM3.5mm 8A 250V AC Form A Relay SPST Schrack-RT1 RM3.5mm 8A 250V AC Form A http://image.schrack.com/datenblaetter/h_rp810012-b.pdf Relay SPST Relay SPST-NO Omron Serie G6EK, see http://www.logosfoundation.org/instrum_gwr/pi/Omron_G6E_134P.pdf Relay SPDT Potter&Brumfield T9AP5D52 12V 30A 1xUn Connector Fast ON Only Dummy for Space NO Pads Relay RAYEX L90S SPDT relay Sanyou SRD series Form A http://www.alliedelec.com/m/d/543c6bed18bf23a83ae5238947033ee0.pdf Relay SPST Schrack-RP-II/1 RM5mm 16A 250V AC Relay Standex-Meder SIL-relais, Form 1B, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex-Meder SIL-relais, Form 1C, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex-Meder SIL-relais, Form 1A/1B, see https://standexelectronics.com/de/produkte/ms-reed-relais/ Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for Everlight ITR1201SR10AR, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467146/SFH%202440_EN.pdf DFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator JST XA series connector, LY20-40P-DLT1, 20 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9.
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