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Https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP Switch SPST Slide 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic Micro Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (SS)-5.30 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 14 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf 8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/ TO-50-3 Macro T Package Style M234 Rohm HRP7 SMD package, tab to pin 1, https://www.wolfspeed.com/media/downloads/137/C3D06060G.pdf D2PAK DDPAK TO-263 D2PAK-5 TO-263-5 SOT-426 TO-263 / D2PAK / DDPAK SMD package, tab to pin 1 x 1 mm, 734-143 , 13 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, S08B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with.

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