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PWM output, Modbus, THT co2 gas sensor pwm modbus Sensirion SCD4x QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://www.ti.com/lit/ds/symlink/msp430f5217.pdf#page=120), generated with kicad-footprint-generator Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 1, Wuerth electronics 9775051960 (https://katalog.we-online.com/em/datasheet/9775051960.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105310-xx06, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [QFN]; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 10x10mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch.

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