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Back(https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 44 leads; body width 7.5 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 14110413010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [QFN] with thermal pad LQFP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc0015.pdf), generated with kicad-footprint-generator JST XA series connector, B2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.nxp.com/docs/en/package-information/98ASA00694D.pdf DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to the Program is Distributed as Source.
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