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Elektronik, Wuerth_MAPI-2506, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2010, 2.0mmx1.6mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2510, 2.5mmx2.0mm Inductor, Wuerth Elektronik, Wuerth_HCM-1050, 10.2mmx7.0mm inductor Wuerth hci smd Inductor, Sagami, h=8.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Sagami power inductor, CWR1242C, H=7.7mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf SMD Power Inductor WE-PD 7345 Wuerth Shielded Power Inductors (https://www.bourns.com/docs/product-datasheets/srp7028a.pdf Shielded Inductors Bourns SMD SRP7028A Bourns SRP1208 series SMD inductor, https://www.bourns.com/docs/Product-Datasheets/SRN4018.pdf Bourns SRN4018 SMD inductor http://www.bourns.com/docs/product-datasheets/srp2313aa.pdf Bourns SRR1260 series SMD inductor, https://www.bourns.com/docs/Product-Datasheets/SRU1028.pdf Bourns SRU1028 series SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280), generated with kicad-footprint-generator Molex.

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