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TO-220F-4 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-7 Horizontal RM 2.54mm TO-220-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-9, Horizontal, RM 1.27mm, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-7 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-9 Vertical RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, staggered type-2 TO-220F-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 2.54mm TO-220F-3, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 10.9mm TO-264-2, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 32-lead dip package, row spacing 10.16 mm (400 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf.

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