Labels Milestones
BackST WLCSP-81, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments BGA-289, 0.4mm pad, based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 40 contacts (polarized Highspeed card edge connector for PCB's with 08 contacts (not polarized Highspeed card edge connector for IQRF TR-x2DA(T) modules, http://iqrf.org/weben/downloads.php?id=104 Bluetooth v4.2 + NFC module Modtronix Wireless SX1276 LoRa Module (http://modtronix.com/img/prod/imod/inair9/inair_dimensions.gif Modtronix LoRa inAir inAir9 SX1276 RF 915MHz 868MHz Wireless RAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth Module with on-board components Moritz Klein (and derivatives 1 0 20.5 vertex 0.95 4.22131 20.5 vertex 0.95 7.77656 6.96334 vertex -0.95 6.11494 21.5472 vertex -0.95 7.77656 6.96334 vertex -0.95 0 22.5 vertex -0.95 5.48429 22.5 vertex 0.95 0 22.5 vertex -0.95 5.78941 6.73694 vertex -0.95 6.11494 21.5472 vertex -0.95 0 22.5 vertex 0.95 6.11494 21.5472 vertex 0.95 7.77656 6.96334 vertex -0.95 0 22.5 vertex -0.95 0 22.5 vertex -0.95 5.78941 6.73694 vertex 1 7.12044 7.60042 vertex -1 7.23463 7.52583 vertex -1 6.28946 13.3638 vertex 1 7.26455 7.25222 vertex -1 5.30257 21.8229 vertex 1 7.16683 7.57523 vertex 1 7.12044 7.60042 vertex 1 5.30257 21.8229 vertex -1 7.23003 7.56779 vertex -1 0 22.0001 vertex 4.50529 -2.92564 22.0001 vertex 2.92564 4.50529 22.0001 vertex -5.37835 0 22.0001 vertex.
- Mpn: 39-29-4169, 8 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf.
- (https://www.silabs.com/documents/public/data-sheets/cp2108-datasheet.pdf), generated with kicad-footprint-generator Molex SPOX.
- Hole PLCC, 68 pins, through hole.