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BackPowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch, vertical, SMT J bend https://dznh3ojzb2azq.cloudfront.net/products/Slide/JS/documents/datasheet.pdf MEC 5G single pole double throw | | | C9 | 5 | 22k | Resistor | | | | C13 | 3 | 4.7k | Resistor | | Tayda | A-1672 | | Tayda | A-111 | | R114 | 1 | Conn_01x02 | SIP socket, 2.54 mm, 1x7 | | R4, R6, R7 | 3 | 22k | Resistor | | S3 | 1 | SW_Push | Push button switch | | | | | | | Screws and spacers (see build notes) 1 SIP socket, 2.54 mm, 1x7 | | | | | Tayda | A-1121 | | S3 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-14/SOIC-14"/>