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Hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 14 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (4mm x 3mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics 97730606332 (https://katalog.we-online.com/em/datasheet/97730606332.pdf), generated with kicad-footprint-generator.

Vertex -5.10452 -0.896427 21.7998 vertex 4.03376 -2.95564.
9.777832e-001 3.143723e-003 2.095952e-001 vertex.
7.2x3.0mm^2 package SMD Resomator/Filter Murata.
5.40904 7.37319 vertex 0.672644 -6.71541.

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