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Pin socket, 2.54 mm, 1x10 Pin header, 2.54 mm, 1x2 (see [build notes](build.md)) | | C4, C5 | 2 Fireball/Fireball.kicad_prl | 75 .../Unseen Servant/Unseen Servant.kicad_pro Normal file Unescape "Name": "Top Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Silk Screen" "Name": "Top Solder Mask" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Top Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-F_SilkS.gbr Normal file Unescape REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc, if multiple measures or variations) BSD: back surdo // 1 for cv glide atten (rv15 // 13 SPDT switches Subject: [PATCH 2/2] Update README.md 8fe829edc2a52299443ce1d2193e2aa04d060c17 From b22080a808f5ee5eddd0b607f432f7fa2c4fb139 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Schematic updates main synth_tools/Schematics/SynthMages.pretty/SOCKET_2_PIN_Header.kicad_mod 44 lines main synth_tools/Panels/Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf → Panels/Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a single 1 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 505405-1070 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 2.5 mm² wires, basic insulation, conductor diameter 1.7mm.

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