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Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.8mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (http://www.thatcorp.com/datashts/THAT_626x_Datasheet.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System.

7.524737e-001 vertex 3.480290e+000 2.717579e+000 2.488700e+001 facet.
0.109912 -0.552086 -0.826511 vertex 0.566007.
PT-1,5-13-3.5-H pitch 3.5mm size.
Schematics/Luthers_Perfboard.pdf | Bin 0 -> 146728 bytes Images/IMG_6771.JPG.

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