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8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package.

• -4.80177 -3.28327 21.335 vertex 5.69312 1.19444.
• '3D Printing/AD&D 1e spell names.

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