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Signal relay DPDT non single coil latching surface mount PLCC, 28 pins, through hole, DF11-32DP-2DSA, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xxx-DV-BE-LC, 15 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator JST SH series connector, 501331-0807 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/6-V-5.0-EX Terminal Block, 1732386 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732386), generated with StandardBox.py) (https://www.bourns.com/docs/Product-Datasheets/SRF1260.pdf Bourns SRP1245A SMD inductor Bourns SRU1028 series SMD inductor, https://www.bourns.com/docs/Product-Datasheets/SRN4018.pdf Bourns SRN4018 series SMD inductor http://www.bourns.com/docs/Product-Datasheets/SRP1245A.pdf Bourns SRP1245A series SMD inductor Bourns SRR1260 SMD inductor http://www.bourns.com/docs/Product-Datasheets/SRP1245A.pdf Bourns SRP1245A SMD inductor Bourns SRU8028 SMD inductor Bourns SRP1770TA series SMD inductor http://www.bourns.com/docs/Product-Datasheets/SRP1245A.pdf Bourns SRP1245A series SMD inductor Inductor, Bourns, SRP5030T, 5.7mmx5.2mm (Script generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 56 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils.

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