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BackMolex KK 396 Interconnect System, old/engineering part number: 26-60-4100, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.5mm, hole diameter 0.7mm, length 6.5mm, width 1.8mm solder Pin_ loose fit solder Pin_ diameter 1.3mm, wire diameter 1.0mm test point plated hole Plated Hole as test point, loop diameter 3.8mm, hole diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 through hole, 2 LEDs, tab down, http://www.hanrun.com/public/upload/down/2020/09-11/cc11be56d66bb63d5f1eeb85492439c0.pdf Through hole angled pin header, 2x05, 1.00mm pitch, 2.0mm pin length, single row Through hole straight pin header, 1x39, 2.00mm pitch, 6.35mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header THT 2x33 1.00mm double row Through hole pin header SMD 1x33 1.27mm.
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