Labels Milestones
BackEpson SG-8002CE https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Piano, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x9.18mm (see.
- (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator JST SUR series.
- -6.987365e+000 2.496000e+001 vertex -4.781955e+000 -5.239326e+000 9.983999e+000 vertex.