Labels Milestones
BackDSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header, 2x15, 1.27mm pitch, double rows Through hole angled pin header, 1x25, 2.54mm pitch, 6mm pin length, double rows Through hole angled pin header SMD 2x05 2.54mm double row Through hole angled pin header, 2x11, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x22 1.27mm double row surface-mounted straight pin header, 2x02, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x23, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x06 1.00mm double row Through hole vertical IDC box header THT 2x36 2.54mm double row Through hole vertical IDC header THT 1x33 2.54mm single row Surface mounted pin header SMD 1x25 1.27mm single row Through hole angled pin header THT 1x08 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x15, 2.54mm pitch, 6mm pin length, single row Through hole angled pin header, 1x12, 1.00mm pitch, 2.0mm pin length, double rows Through hole pin header SMD 2x22 2.00mm double row surface-mounted straight socket strip, 1x12, 2.54mm.