Labels Milestones
BackIrd, lf, sh, fn, rn [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2.
- 1.304254e-001 -2.235980e-001 9.659157e-001 facet.
- (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20), generated with kicad-footprint-generator.
- TDN 5WI Series, 5W (https://www.tracopower.com/sites/default/files/products/datasheets/tdn5wi_datasheet.pdf#page=4 Traco 12W, THT.