3
1
Back

(http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with kicad-footprint-generator Molex SPOX horizontal Molex KK 396 Interconnect System, old/engineering part number: AE-6410-03A example for new mpn: 39-28-904x, 2 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600.

New Pull Request