Labels Milestones
Back[MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see.
- Docs/precadsr_bom.md | 72 Hardware/PCB/precadsr/potsetc.sch | 4 .
- Wire, reinforced insulation, conductor.
[MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see.