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[DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip SMD 1x25 1.00mm single row style2 pin1 right Through hole horizontal IDC header THT 1x11 5.08mm single row style2 pin1 right Through hole angled pin header, 2x31, 1.00mm pitch, 2.0mm pin length, single row style2 pin1 right Through hole IDC header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 1x18 1.00mm single row male, vertical entry, with latches, PN:G125-MVX0605L1X Harwin Gecko Connector, 16 pins, pitch 5.08mm, size 71.1x11.2mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo. 10701, vertical (cable from top.

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