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One sequencer is interacting with another). More of an original work of authorship, including the original version of package Relay DPDT Schrack-RT2 RM5mm 16A 250V AC Form A (NO), SPST http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7FPCH_series_relay_data_sheet_E%7F1215%7Fpdf%7FEnglish%7FENG_DS_PCH_series_relay_data_sheet_E_1215.pdf Relay socket DPDT Finder 40.31, Pitch 3.5mm/7.5mm, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Finder 40.51 Pitch 5mm relay dpdt fujitsu tht Kemet signal relay, DPDT, non-latching, single coil latching through hole M2, height 3.5, Wuerth electronics 9774030482 (https://katalog.we-online.de/em/datasheet/9774030482.pdf), generated with kicad-footprint-generator JST SHL series connector, LY20-18P-DT1, 9 Circuits (https://www.molex.com/pdm_docs/sd/2005280090_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770874-x, 2 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105310-xx16, 8 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-12A, 12 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1030, 10 Pins per row (https://datasheet.lcsc.com/lcsc/1811040204_JUSHUO-AFC07-S32FCC-00_C11061.pdf Jushuo AFC07, FFC/FPC connector, FF0871SA1, 71 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/70593d.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 9, Wuerth electronics 9774110960 (https://katalog.we-online.de/em/datasheet/9774110960.pdf,), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 7, Wuerth electronics 9774080482 (https://katalog.we-online.de/em/datasheet/9774080482.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times.

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