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Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin straight chassis connector Dual front isolated BNC plug (https://www.winconn.com/wp-content/uploads/364A2595.pdf Dual BNC Amphenol Horizontal Panel-mountable BNC connector mounted through PCB, vertical BNC RF interface bayonet 50ohm BNC female PCB mount 4 pin, 0.3mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 4.

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