3
1
Back

300mil 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 8-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge package, diameter 8.9mm, pin pitch 7.50mm length 10.3mm width 5.7mm Capacitor C, Radial series, Radial, pin pitch=27.50mm, , length*width=29*14.2mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 5.00mm diameter 12.5mm Electrolytic Capacitor CP Radial series Radial pin pitch 5.00mm diameter 11mm Fastron 77A Inductor, Axial series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W length 6.3mm diameter 2.5mm wire loop as test Point, diameter 1.5mm THT pad as test Point, diameter 1.0mm wire loop as test Point, square 4.0mm side length SMD rectangular pad as test Point, square 3.0mm side length test point wire loop as test Point, square 1.5mm.

New Pull Request