3
1
Back

2x4mm Pitch 0.4mm 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf.

New Pull Request