synth_tools

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(HP row_2 = row_1 + v_margin + 12; row_1 = vertical_space/7; row_2 = row_1 + vertical_space/7; row_4 = row_3 + vertical_space/7; cv_in_1a = [left_col, row_7, 0]; cv_in_1b = [right_col, row_3, 0]; c_tune = [width_mm/2 - h_margin, top_row, 0]; f_tune = [second_col, fifth_row, 0]; //right_rib_x = width_mm - thickness; // column from edge plus hole radius // elevated sockets to fit in glide controls Final-ish tweaks Final-ish tweaks 45c41b9873c867fd482202c4f0c018a6f3903a54 Messing around with panel alignment before printing Latest commits for file Schematics/Dual_VCA_with_cv2.diy Add radio shaek with cv2 version d9153c70802a10d2fe554f80f1a497b409aac630 sr1 e49f4ab127dc081ee1c77dd21e80d128628a1152 ec67859b1c2779470b99801ce69f8850b83fa3e1 Add radio shaek with cv2 version From ac58a9eaed22afe21d4e9041218f4495bd28c6bf Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png revised README.md to rev 2 d5bfb6e27b2dae54104d76ea378df4de16af205b corrects inexplicably begreebled lower thre knob labels; confirms mask color is as defined replaces FIREBALL mask/etch with silkscreen fd8b2dd8a7 adds ideas for a single 0.15 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C receptacle for USB 2.0 16P 16C USB4105-15-A USB4105-15-A-060 USB4105-15-A-120 USB4105-GF-A USB4105-GF-A-060 USB4105-GF-A-120 USB Type C, Right Angle, Surface Mount, Push-Pull Type, 1.42mm Height, with Detect Switch (https://www.molex.com/pdm_docs/sd/1040310811_sd.pdf Micro SD Wuerth Wurth Würth dual independently isolated BNC plug (https://www.amphenolrf.com/downloads/dl/file/id/2980/product/644/031_6575_customer_drawing.pdf Dual BNC Amphenol Horizontal.

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